Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.032" (0.81mm), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean, Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Wire Solder, Zloženie: Pb93.5Sn5Ag1.5 (93.5/5/1.5), Priemer: 0.022" (0.56mm), Bod topenia: 565 ~ 574°F (296 ~ 301°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 23 AWG, 24 SWG,
Typ: Wire Solder, Zloženie: Sn60Pb40 (60/40), Priemer: 0.015" (0.38mm), Bod topenia: 361 ~ 374°F (183 ~ 190°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 27 AWG, 28 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.015" (0.38mm), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean, Drôtené meradlo: 27 AWG, 28 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.015" (0.38mm), Bod topenia: 361°F (183°C), Typ tavidla: Water Soluble, Drôtené meradlo: 27 AWG, 28 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.024" (0.61mm), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean, Drôtené meradlo: 22 AWG, 23 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.024" (0.61mm), Bod topenia: 361°F (183°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 22 AWG, 23 SWG,
Typ: Wire Solder, Zloženie: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Priemer: 0.040" (1.02mm), Bod topenia: 423°F (217°C), Typ tavidla: No-Clean, Drôtené meradlo: 18 AWG, 19 SWG,
Typ: Wire Solder, Priemer: 0.015" (0.38mm), Typ tavidla: No-Clean, Drôtené meradlo: 27 AWG, 28 SWG,
Typ: Wire Solder, Priemer: 0.022" (0.56mm), Typ tavidla: No-Clean, Drôtené meradlo: 23 AWG, 24 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.022" (0.56mm), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean, Drôtené meradlo: 23 AWG, 24 SWG,
Typ: Wire Solder, Priemer: 0.040" (1.02mm), Typ tavidla: No-Clean, Drôtené meradlo: 18 AWG, 19 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.015" (0.38mm), Bod topenia: 361°F (183°C), Typ tavidla: Rosin Mildly Activated (RMA), Drôtené meradlo: 27 AWG, 28 SWG,
Typ: Wire Solder, Zloženie: Sn50Pb48.5Cu1.5 (50/48.5/1.5), Priemer: 0.032" (0.81mm), Bod topenia: 361 ~ 420°F (183 ~ 216°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: Water Soluble,
Typ: Wire Solder, Zloženie: Sn97Cu3 (97/3), Priemer: 0.128" (3.25mm), Drôtené meradlo: 8 AWG, 10 SWG,
Typ: Wire Solder, Zloženie: Sn50Pb48.5Cu1.5 (50/48.5/1.5), Priemer: 0.048" (1.22mm), Bod topenia: 361 ~ 420°F (183 ~ 216°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 16 AWG, 18 SWG,
Typ: Bar Solder, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C),
Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Typ tavidla: No-Clean,
Typ: Wire Solder, Zloženie: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Priemer: 0.032" (0.81mm), Bod topenia: 423°F (217°C), Typ tavidla: No-Clean, Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Wire Solder, Zloženie: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Priemer: 0.022" (0.56mm), Bod topenia: 423°F (217°C), Typ tavidla: No-Clean, Drôtené meradlo: 23 AWG, 24 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.064" (1.63mm), Bod topenia: 423°F (217°C), Typ tavidla: No-Clean, Drôtené meradlo: 14 AWG, 16 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.048" (1.22mm), Bod topenia: 423°F (217°C), Typ tavidla: No-Clean, Drôtené meradlo: 16 AWG, 18 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.022" (0.56mm), Bod topenia: 423°F (217°C), Typ tavidla: No-Clean, Drôtené meradlo: 23 AWG, 24 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.032" (0.81mm), Bod topenia: 423°F (217°C), Typ tavidla: No-Clean, Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Bar Solder, Zloženie: Sn99.3Cu0.7 (99.3/0.7), Bod topenia: 440 ~ 464°F (227 ~ 240°C),
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.032" (0.81mm), Bod topenia: 423°F (217°C), Typ tavidla: Water Soluble, Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Wire Solder, Zloženie: Sn99.3Cu0.7 (99.3/0.7), Priemer: 0.064" (1.63mm), Bod topenia: 440 ~ 464°F (227 ~ 240°C), Typ tavidla: No-Clean, Drôtené meradlo: 14 AWG, 16 SWG,
Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423°F (217°C), Typ tavidla: No-Clean,
