Typ: Solder Paste, Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423°F (217°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423°F (217°C),
Typ: Solder Paste, Bod topenia: 546 ~ 567°F (286 ~ 297°C),
Typ: Wire Solder, Zloženie: Sn60Pb40 (60/40), Priemer: 0.064" (1.63mm), Bod topenia: 361 ~ 374°F (183 ~ 190°C), Typ tavidla: No-Clean, Drôtené meradlo: 14 AWG, 16 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3.5 (96.5/3.5), Priemer: 0.063" (1.60mm), Bod topenia: 430°F (221°C), Drôtené meradlo: 14 AWG, 16 SWG,
Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: Water Soluble,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.032" (0.81mm), Bod topenia: 361°F (183°C), Typ tavidla: Rosin Mildly Activated (RMA), Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.022" (0.56mm), Bod topenia: 361°F (183°C), Typ tavidla: Rosin Mildly Activated (RMA), Drôtené meradlo: 23 AWG, 24 SWG,
Typ: Solder Paste, Zloženie: Bi58Sn42 (58/42), Bod topenia: 281°F (138°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Bod topenia: 411 ~ 424°F (209 ~ 218°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Bod topenia: 410 ~ 424°F (209 ~ 218°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Bod topenia: 409 ~ 424°F (209 ~ 218°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Bod topenia: 408 ~ 424°F (209 ~ 218°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 350°F (177°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 401 ~ 424°F (205 ~ 218°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Bod topenia: 423°F (217°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Sn62Pb36Ag2 (62/36/2), Bod topenia: 354°F (179°C), Typ tavidla: Water Soluble,
Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423°F (217°C), Typ tavidla: Water Soluble,