Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.020" (0.51mm), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: No-Clean, Drôtené meradlo: 24 AWG, 25 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.010" (0.25mm), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: No-Clean, Drôtené meradlo: 30 AWG, 33 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.031" (0.79mm), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: No-Clean, Drôtené meradlo: 20 AWG, 22 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.025" (0.64mm), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: No-Clean, Drôtené meradlo: 22 AWG, 23 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.010" (0.25mm), Bod topenia: 361°F (183°C), Typ tavidla: Rosin Mildly Activated (RMA), Drôtené meradlo: 30 AWG, 33 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.040" (1.02mm), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: No-Clean, Drôtené meradlo: 18 AWG, 19 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.062" (1.57mm), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: No-Clean, Drôtené meradlo: 14 AWG, 16 SWG,
Typ: Wire Solder, Zloženie: Sn62Pb36Ag2 (62/36/2), Priemer: 0.015" (0.38mm), Bod topenia: 354°F (179°C), Typ tavidla: Rosin Mildly Activated (RMA), Drôtené meradlo: 27 AWG, 28 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.025" (0.64mm), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: Water Soluble, Drôtené meradlo: 22 AWG, 23 SWG,
Typ: Wire Solder, Zloženie: Sn62Pb36Ag2 (62/36/2), Priemer: 0.031" (0.79mm), Bod topenia: 354°F (179°C), Typ tavidla: No-Clean, Drôtené meradlo: 20 AWG, 22 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.040" (1.02mm), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: Water Soluble, Drôtené meradlo: 18 AWG, 19 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.031" (0.79mm), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: Water Soluble, Drôtené meradlo: 20 AWG, 22 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.015" (0.38mm), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: No-Clean, Drôtené meradlo: 27 AWG, 28 SWG,
Typ: Wire Solder, Zloženie: Sn62Pb36Ag2 (62/36/2), Priemer: 0.020" (0.51mm), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean, Drôtené meradlo: 24 AWG, 25 SWG,
Typ: Wire Solder, Zloženie: Sn60Pb40 (60/40), Priemer: 0.031" (0.79mm), Bod topenia: 361 ~ 374°F (183 ~ 190°C), Typ tavidla: No-Clean, Drôtené meradlo: 20 AWG, 22 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.020" (0.51mm), Bod topenia: 361°F (183°C), Typ tavidla: Water Soluble, Drôtené meradlo: 24 AWG, 25 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.078" (1.98mm), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: No-Clean, Drôtené meradlo: 12 AWG, 14 SWG,
