Typ: Solder Paste, Zloženie: Sn96.3Ag3.7 (96.3/3.7), Bod topenia: 430 ~ 444°F (221 ~ 223°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: Water Soluble,
Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: Water Soluble,
Typ: Solder Paste, Zloženie: Sn99Cu0.7Ag0.3 (99/0.7/0.3), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Sn62Pb36Ag2 (62/36/2), Bod topenia: 354°F (179°C), Typ tavidla: Water Soluble,
Typ: Solder Paste, Zloženie: Sn62Pb36Ag2 (62/36/2), Bod topenia: 354°F (179°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: Rosin Mildly Activated (RMA),