Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.020" (0.51mm), Bod topenia: 423 ~ 428°F (217 ~ 220°C), Typ tavidla: No-Clean, Water Soluble, Drôtené meradlo: 24 AWG, 25 SWG,
Typ: Wire Solder, Zloženie: Sn99.3Cu0.7 (99.3/0.7), Priemer: 0.015" (0.38mm), Bod topenia: 441°F (227°C), Typ tavidla: No-Clean, Water Soluble,
Typ: Wire Solder, Zloženie: In52Sn48 (52/48), Priemer: 0.031" (0.79mm), Bod topenia: 244°F (118°C), Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Wire Solder, Zloženie: Sn62Pb36Ag2 (62/36/2), Priemer: 0.031" (0.79mm), Bod topenia: 354°F (179°C), Typ tavidla: No-Clean, Water Soluble,
Typ: Solder Sphere, Zloženie: Sn63Pb37 (63/37), Priemer: 0.014" (0.36mm), Bod topenia: 361°F (183°C),
Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 428°F (217 ~ 220°C), Typ tavidla: No-Clean,
Typ: Solder Sphere, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.030" (0.76mm), Bod topenia: 423 ~ 428°F (217 ~ 220°C),
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.031" (0.79mm), Bod topenia: 423 ~ 428°F (217 ~ 220°C), Typ tavidla: No-Clean, Water Soluble, Drôtené meradlo: 20 AWG, 22 SWG,
Typ: Solder Sphere, Zloženie: Sn63Pb37 (63/37), Priemer: 0.020" (0.51mm), Bod topenia: 361°F (183°C),
Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: Water Soluble,
Typ: Solder Paste, Two Part Mix, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 428°F (217 ~ 220°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Bod topenia: 281°F (138°C), Typ tavidla: No-Clean,
Typ: Solder Sphere, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.014" (0.36mm), Bod topenia: 423 ~ 428°F (217 ~ 220°C),
Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 428°F (217 ~ 220°C), Typ tavidla: Water Soluble,
Typ: Wire Solder, Zloženie: Sn99.3Cu0.7 (99.3/0.7), Priemer: 0.020" (0.51mm), Bod topenia: 441°F (227°C), Typ tavidla: No-Clean, Water Soluble,
Typ: Solder Paste, Zloženie: Sn96.5Ag3.5 (96.5/3.5), Bod topenia: 430°F (221°C), Typ tavidla: Water Soluble,
Typ: Solder Sphere, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.012" (0.31mm), Bod topenia: 423 ~ 428°F (217 ~ 220°C),
Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean,
