Spájka

SMD3SW.031 1OZ

SMD3SW.031 1OZ

diel: 294

Typ: Wire Solder, Zloženie: Sn62Pb36Ag2 (62/36/2), Priemer: 0.031" (0.79mm), Bod topenia: 354°F (179°C), Typ tavidla: No-Clean, Water Soluble,

Na priania
SMD2028

SMD2028

diel: 61

Typ: Solder Sphere, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.014" (0.36mm), Bod topenia: 423 ~ 428°F (217 ~ 220°C),

Na priania
SMDLTLFP10T4

SMDLTLFP10T4

diel: 2787

Typ: Solder Paste, Zloženie: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Bod topenia: 281°F (138°C), Typ tavidla: No-Clean,

Na priania
SMD291SNL10

SMD291SNL10

diel: 3001

Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 428°F (217 ~ 220°C), Typ tavidla: No-Clean,

Na priania
SMD291AX250T5

SMD291AX250T5

diel: 821

Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean,

Na priania
SMDAL50

SMDAL50

diel: 98

Typ: Solder Paste, Zloženie: Sn96.5Ag3.5 (96.5/3.5), Bod topenia: 430°F (221°C), Typ tavidla: Water Soluble,

Na priania
SMD2165-25000

SMD2165-25000

diel: 2214

Typ: Solder Sphere, Zloženie: Sn63Pb37 (63/37), Priemer: 0.012" (0.31mm), Bod topenia: 361°F (183°C),

Na priania
SMD291SNL50T3

SMD291SNL50T3

diel: 4361

Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 428°F (217 ~ 220°C), Typ tavidla: No-Clean,

Na priania
SMDSWLF.006 50G

SMDSWLF.006 50G

diel: 399

Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.006" (0.15mm), Bod topenia: 423 ~ 428°F (217 ~ 220°C), Typ tavidla: No-Clean, Water Soluble, Drôtené meradlo: 34 AWG, 38 SWG,

Na priania
SMD3SW.031 8OZ

SMD3SW.031 8OZ

diel: 450

Typ: Wire Solder, Zloženie: Sn62Pb36Ag2 (62/36/2), Priemer: 0.031" (0.79mm), Bod topenia: 354°F (179°C), Typ tavidla: No-Clean, Water Soluble, Drôtené meradlo: 20 AWG, 22 SWG,

Na priania
SMD2180

SMD2180

diel: 12

Typ: Solder Sphere, Zloženie: Sn63Pb37 (63/37), Priemer: 0.016" (0.40mm), Bod topenia: 361°F (183°C),

Na priania
SMDAL400C

SMDAL400C

diel: 62

Typ: Solder Paste, Zloženie: Sn96.5Ag3.5 (96.5/3.5), Bod topenia: 430°F (221°C), Typ tavidla: Water Soluble,

Na priania
SMDSW.020 1OZ

SMDSW.020 1OZ

diel: 14624

Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.020" (0.51mm), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean, Water Soluble, Drôtené meradlo: 24 AWG, 25 SWG,

Na priania
SMD2SWLF.015 .3OZ

SMD2SWLF.015 .3OZ

diel: 664

Typ: Wire Solder, Zloženie: Sn99.3Cu0.7 (99.3/0.7), Priemer: 0.015" (0.38mm), Bod topenia: 441°F (227°C), Typ tavidla: No-Clean, Water Soluble, Drôtené meradlo: 27 AWG, 28 SWG,

Na priania
SMD2205

SMD2205

diel: 927

Typ: Solder Sphere, Zloženie: Sn63Pb37 (63/37), Priemer: 0.025" (0.64mm), Bod topenia: 361°F (183°C),

Na priania
SMD3SW.015 100G

SMD3SW.015 100G

diel: 377

Typ: Wire Solder, Zloženie: Sn62Pb36Ag2 (62/36/2), Priemer: 0.015" (0.38mm), Bod topenia: 354°F (179°C), Typ tavidla: No-Clean, Water Soluble, Drôtené meradlo: 27 AWG, 28 SWG,

Na priania
SMD2170-25000

SMD2170-25000

diel: 72

Typ: Solder Sphere, Zloženie: Sn63Pb37 (63/37), Priemer: 0.014" (0.36mm), Bod topenia: 361°F (183°C),

Na priania
TS391LT10

TS391LT10

diel: 569

Typ: Solder Paste, Zloženie: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Bod topenia: 281°F (138°C), Typ tavidla: No-Clean,

Na priania
SMD3SW.020 2OZ

SMD3SW.020 2OZ

diel: 372

Typ: Wire Solder, Zloženie: Sn62Pb36Ag2 (62/36/2), Priemer: 0.020" (0.51mm), Bod topenia: 354°F (179°C), Typ tavidla: No-Clean, Water Soluble,

Na priania
SMDSW.031 4OZ

SMDSW.031 4OZ

diel: 7596

Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.031" (0.79mm), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean, Water Soluble, Drôtené meradlo: 20 AWG, 22 SWG,

Na priania
SMD2215-25000

SMD2215-25000

diel: 2888

Typ: Solder Sphere, Zloženie: Sn63Pb37 (63/37), Priemer: 0.030" (0.76mm), Bod topenia: 361°F (183°C),

Na priania
SMD2185-25000

SMD2185-25000

diel: 52

Typ: Solder Sphere, Zloženie: Sn63Pb37 (63/37), Priemer: 0.018" (0.46mm), Bod topenia: 361°F (183°C),

Na priania
SMD291AX250T3

SMD291AX250T3

diel: 1818

Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean,

Na priania
SMDSWLF.020 1LB

SMDSWLF.020 1LB

diel: 148

Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.020" (0.51mm), Bod topenia: 423 ~ 428°F (217 ~ 220°C), Typ tavidla: No-Clean, Water Soluble, Drôtené meradlo: 24 AWG, 25 SWG,

Na priania
SMD2SWLF.015 1OZ

SMD2SWLF.015 1OZ

diel: 270

Typ: Wire Solder, Zloženie: Sn99.3Cu0.7 (99.3/0.7), Priemer: 0.015" (0.38mm), Bod topenia: 441°F (227°C), Typ tavidla: No-Clean, Water Soluble,

Na priania
SMDIN52SN48

SMDIN52SN48

diel: 598

Typ: Wire Solder, Zloženie: In52Sn48 (52/48), Priemer: 0.031" (0.79mm), Bod topenia: 244°F (118°C), Drôtené meradlo: 20 AWG, 21 SWG,

Na priania
SMD3SW.031 2OZ

SMD3SW.031 2OZ

diel: 370

Typ: Wire Solder, Zloženie: Sn62Pb36Ag2 (62/36/2), Priemer: 0.031" (0.79mm), Bod topenia: 354°F (179°C), Typ tavidla: No-Clean, Water Soluble,

Na priania
SMD2170

SMD2170

diel: 87

Typ: Solder Sphere, Zloženie: Sn63Pb37 (63/37), Priemer: 0.014" (0.36mm), Bod topenia: 361°F (183°C),

Na priania
SMD291SNL500T3C

SMD291SNL500T3C

diel: 710

Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 428°F (217 ~ 220°C), Typ tavidla: No-Clean,

Na priania
SMD2060

SMD2060

diel: 762

Typ: Solder Sphere, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.030" (0.76mm), Bod topenia: 423 ~ 428°F (217 ~ 220°C),

Na priania
SMDSWLF.020 8OZ

SMDSWLF.020 8OZ

diel: 261

Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.020" (0.51mm), Bod topenia: 423 ~ 428°F (217 ~ 220°C), Typ tavidla: No-Clean, Water Soluble, Drôtené meradlo: 24 AWG, 25 SWG,

Na priania
TS391SNL250

TS391SNL250

diel: 80

Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 428°F (217 ~ 220°C), Typ tavidla: No-Clean,

Na priania
TS391SNL10

TS391SNL10

diel: 209

Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 428°F (217 ~ 220°C), Typ tavidla: No-Clean,

Na priania
SMDSWLF.031 8OZ

SMDSWLF.031 8OZ

diel: 367

Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.031" (0.79mm), Bod topenia: 423 ~ 428°F (217 ~ 220°C), Typ tavidla: No-Clean, Water Soluble, Drôtené meradlo: 20 AWG, 22 SWG,

Na priania
SMD2190

SMD2190

diel: 886

Typ: Solder Sphere, Zloženie: Sn63Pb37 (63/37), Priemer: 0.020" (0.51mm), Bod topenia: 361°F (183°C),

Na priania
MM01039

MM01039

diel: 9055

Typ: Wire Solder, Zloženie: Sn62Pb38 (62/38), Priemer: 0.032" (0.81mm), Bod topenia: 361°F (183°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 20 AWG, 21 SWG,

Na priania