Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: Water Soluble,
Typ: Solder Paste, Zloženie: Sn62Pb36Ag2 (62/36/2), Bod topenia: 354°F (179°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: Water Soluble,
Typ: Solder Paste, Zloženie: Sn62Pb36Ag2 (62/36/2), Bod topenia: 354°F (179°C), Typ tavidla: Water Soluble,
Typ: Solder Paste, Zloženie: Sn95Sb5 (95/5), Bod topenia: 450 ~ 464°F (232 ~ 240°C), Typ tavidla: No-Clean,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.118" (3.00mm), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Drôtené meradlo: 9 AWG, 11 SWG,
Typ: Wire Solder, Zloženie: Sn97Ag3 (97/3), Priemer: 0.118" (3.00mm), Bod topenia: 430 ~ 435°F (221 ~ 224°C), Drôtené meradlo: 9 AWG, 11 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.118" (3.00mm), Bod topenia: 361°F (183°C), Drôtené meradlo: 9 AWG, 11 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.032" (0.81mm), Bod topenia: 423°F (217°C), Typ tavidla: No-Clean, Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.022" (0.56mm), Bod topenia: 423°F (217°C), Typ tavidla: No-Clean, Drôtené meradlo: 23 AWG, 24 SWG,
Typ: Wire Solder, Zloženie: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Priemer: 0.032" (0.81mm), Bod topenia: 423°F (217°C), Typ tavidla: No-Clean, Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Wire Solder, Priemer: 0.032" (0.81mm), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean, Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Wire Solder, Zloženie: Sn99.3Cu0.7 (99.3/0.7), Priemer: 0.032" (0.81mm), Bod topenia: 440 ~ 464°F (227 ~ 240°C), Typ tavidla: No-Clean, Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Wire Solder, Priemer: 0.022" (0.56mm), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean, Drôtené meradlo: 23 AWG, 24 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.015" (0.38mm), Bod topenia: 423°F (217°C), Typ tavidla: Water Soluble, Drôtené meradlo: 27 AWG, 28 SWG,
Typ: Wire Solder, Priemer: 0.025" (0.64mm), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean, Drôtené meradlo: 22 AWG, 23 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.028" (0.71mm), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean, Drôtené meradlo: 21 AWG, 22 SWG,
