Spájka | Spájkovanie, odpájanie, prepracovani | 32

70-1302-0511

diel: 9249

Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: Rosin Mildly Activated (RMA),

Na priania

Kester Solder

70-4006-2010

diel: 9189

Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-0403-0910

diel: 9157

Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: Water Soluble,

Na priania

Kester Solder

70-0403-0923

diel: 9223

Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: Water Soluble,

Na priania

Kester Solder

70-0605-0811

diel: 6972

Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-0202-0311

diel: 5757

Typ: Solder Paste, Zloženie: Sn62Pb36Ag2 (62/36/2), Bod topenia: 354°F (179°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-2102-0611

diel: 9239

Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: Water Soluble,

Na priania

Kester Solder

70-3213-0811

diel: 9174

Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-4102-0611

diel: 9199

Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-0902-0511

diel: 9159

Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-0403-0810

diel: 9219

Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: Water Soluble,

Na priania

Kester Solder

70-0605-0910

diel: 9210

Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-0403-0823

diel: 9174

Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: Water Soluble,

Na priania

Kester Solder

70-2102-0310

diel: 9237

Typ: Solder Paste, Zloženie: Sn62Pb36Ag2 (62/36/2), Bod topenia: 354°F (179°C), Typ tavidla: Water Soluble,

Na priania

Kester Solder

70-4021-0811

diel: 9149

Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-0203-0311

diel: 9219

Typ: Solder Paste, Zloženie: Sn62Pb36Ag2 (62/36/2), Bod topenia: 354°F (179°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-4105-0811

diel: 9224

Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-4105-0911

diel: 9204

Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-0102-0311

diel: 9150

Typ: Solder Paste, Zloženie: Sn62Pb36Ag2 (62/36/2), Bod topenia: 354°F (179°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-0102-0611

diel: 9154

Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-4021-1411

diel: 9155

Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-1302-0510

diel: 9225

Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: Rosin Mildly Activated (RMA),

Na priania

Kester Solder

70-1002-0310

diel: 9208

Typ: Solder Paste, Zloženie: Sn62Pb36Ag2 (62/36/2), Bod topenia: 354°F (179°C), Typ tavidla: Water Soluble,

Na priania

Kester Solder

70-0102-0410

diel: 9215

Typ: Solder Paste, Zloženie: Sn62Pb36Ag2 (62/36/2), Bod topenia: 354°F (179°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-2103-0511

diel: 9135

Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: Water Soluble,

Na priania

Kester Solder

70-2102-0511

diel: 6975

Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: Water Soluble,

Na priania

Kester Solder

70-1003-0611

diel: 9156

Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: Water Soluble,

Na priania

Kester Solder

70-0202-0611

diel: 9211

Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-0902-0510

diel: 9215

Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-0202-0310

diel: 9151

Typ: Solder Paste, Zloženie: Sn62Pb36Ag2 (62/36/2), Bod topenia: 354°F (179°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-2102-0610

diel: 9152

Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: Water Soluble,

Na priania

Kester Solder

70-3205-1810

diel: 9190

Typ: Solder Paste, Zloženie: Sn99.3Cu0.7 (99.3/0.7), Bod topenia: 441°F (227°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-0605-0810

diel: 9132

Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-4102-0610

diel: 9141

Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-3213-0810

diel: 9186

Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Typ tavidla: No-Clean,

Na priania

Kester Solder

70-0202-0511

diel: 9177

Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean,

Na priania