Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.015" (0.38mm), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean, Drôtené meradlo: 27 AWG, 28 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.015" (0.38mm), Bod topenia: 361°F (183°C), Typ tavidla: Water Soluble, Drôtené meradlo: 27 AWG, 28 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.024" (0.61mm), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean, Drôtené meradlo: 22 AWG, 23 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.024" (0.61mm), Bod topenia: 361°F (183°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 22 AWG, 23 SWG,
Typ: Wire Solder, Zloženie: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Priemer: 0.040" (1.02mm), Bod topenia: 423°F (217°C), Typ tavidla: No-Clean, Drôtené meradlo: 18 AWG, 19 SWG,
Typ: Wire Solder, Priemer: 0.015" (0.38mm), Typ tavidla: No-Clean, Drôtené meradlo: 27 AWG, 28 SWG,
Typ: Wire Solder, Priemer: 0.022" (0.56mm), Typ tavidla: No-Clean, Drôtené meradlo: 23 AWG, 24 SWG,
Typ: Wire Solder, Zloženie: Sn99.5Cu0.5 (99.5/0.5), Priemer: 0.032" (0.81mm), Bod topenia: 442°F (228°C), Typ tavidla: No-Clean, Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Wire Solder, Zloženie: Sn60Pb40 (60/40), Priemer: 0.050" (1.27mm), Bod topenia: 361 ~ 376°F (183 ~ 191°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 16 AWG, 18 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.032" (0.81mm), Bod topenia: 361°F (183°C), Typ tavidla: Water Soluble, Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.062" (1.57mm), Bod topenia: 361°F (183°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 14 AWG, 16 SWG,
Typ: Wire Solder, Zloženie: Sn60Pb40 (60/40), Priemer: 0.040" (1.02mm), Bod topenia: 361 ~ 376°F (183 ~ 191°C), Typ tavidla: No-Clean, Drôtené meradlo: 18 AWG, 19 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.040" (1.02mm), Bod topenia: 361°F (183°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 18 AWG, 19 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.040" (1.02mm), Bod topenia: 423 ~ 430°F (217 ~ 221°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 18 AWG, 19 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.040" (1.02mm), Bod topenia: 423 ~ 430°F (217 ~ 221°C), Typ tavidla: No-Clean, Drôtené meradlo: 18 AWG, 19 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.032" (0.81mm), Bod topenia: 423 ~ 430°F (217 ~ 221°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Wire Solder, Zloženie: Sn60Pb40 (60/40), Priemer: 0.025" (0.64mm), Bod topenia: 361 ~ 376°F (183 ~ 191°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 22 AWG, 23 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.050" (1.27mm), Bod topenia: 423 ~ 430°F (217 ~ 221°C), Typ tavidla: No-Clean, Drôtené meradlo: 16 AWG, 18 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.050" (1.27mm), Bod topenia: 361°F (183°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 16 AWG, 18 SWG,
Typ: Wire Solder, Zloženie: Sn99.5Cu0.5 (99.5/0.5), Priemer: 0.032" (0.81mm), Bod topenia: 442°F (228°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.032" (0.81mm), Bod topenia: 361°F (183°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Wire Solder, Zloženie: Sn99.5Cu0.5 (99.5/0.5), Priemer: 0.020" (0.51mm), Bod topenia: 442°F (228°C), Typ tavidla: No-Clean, Drôtené meradlo: 24 AWG, 25 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.032" (0.81mm), Bod topenia: 423 ~ 430°F (217 ~ 221°C), Typ tavidla: No-Clean, Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Wire Solder, Zloženie: Sn60Pb40 (60/40), Priemer: 0.040" (1.02mm), Bod topenia: 361 ~ 376°F (183 ~ 191°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 18 AWG, 19 SWG,
Typ: Wire Solder, Zloženie: Sn60Pb40 (60/40), Priemer: 0.062" (1.57mm), Bod topenia: 361 ~ 376°F (183 ~ 191°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 14 AWG, 16 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.032" (0.81mm), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean, Drôtené meradlo: 20 AWG, 21 SWG,
