Typ: Wire Solder, Zloženie: Sn99.5Cu0.5 (99.5/0.5), Priemer: 0.032" (0.81mm), Bod topenia: 442°F (228°C), Typ tavidla: No-Clean, Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Wire Solder, Zloženie: Sn60Pb40 (60/40), Priemer: 0.050" (1.27mm), Bod topenia: 361 ~ 376°F (183 ~ 191°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 16 AWG, 18 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.032" (0.81mm), Bod topenia: 361°F (183°C), Typ tavidla: Water Soluble, Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.062" (1.57mm), Bod topenia: 361°F (183°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 14 AWG, 16 SWG,
Typ: Wire Solder, Zloženie: Sn60Pb40 (60/40), Priemer: 0.040" (1.02mm), Bod topenia: 361 ~ 376°F (183 ~ 191°C), Typ tavidla: No-Clean, Drôtené meradlo: 18 AWG, 19 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.040" (1.02mm), Bod topenia: 361°F (183°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 18 AWG, 19 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.040" (1.02mm), Bod topenia: 423 ~ 430°F (217 ~ 221°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 18 AWG, 19 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.040" (1.02mm), Bod topenia: 423 ~ 430°F (217 ~ 221°C), Typ tavidla: No-Clean, Drôtené meradlo: 18 AWG, 19 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.032" (0.81mm), Bod topenia: 423 ~ 430°F (217 ~ 221°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Wire Solder, Zloženie: Sn60Pb40 (60/40), Priemer: 0.025" (0.64mm), Bod topenia: 361 ~ 376°F (183 ~ 191°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 22 AWG, 23 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.050" (1.27mm), Bod topenia: 423 ~ 430°F (217 ~ 221°C), Typ tavidla: No-Clean, Drôtené meradlo: 16 AWG, 18 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.050" (1.27mm), Bod topenia: 361°F (183°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 16 AWG, 18 SWG,
Typ: Wire Solder, Zloženie: Sn99.5Cu0.5 (99.5/0.5), Priemer: 0.032" (0.81mm), Bod topenia: 442°F (228°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.032" (0.81mm), Bod topenia: 361°F (183°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Wire Solder, Zloženie: Sn99.5Cu0.5 (99.5/0.5), Priemer: 0.020" (0.51mm), Bod topenia: 442°F (228°C), Typ tavidla: No-Clean, Drôtené meradlo: 24 AWG, 25 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.032" (0.81mm), Bod topenia: 423 ~ 430°F (217 ~ 221°C), Typ tavidla: No-Clean, Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Wire Solder, Zloženie: Sn60Pb40 (60/40), Priemer: 0.040" (1.02mm), Bod topenia: 361 ~ 376°F (183 ~ 191°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 18 AWG, 19 SWG,
Typ: Wire Solder, Zloženie: Sn60Pb40 (60/40), Priemer: 0.062" (1.57mm), Bod topenia: 361 ~ 376°F (183 ~ 191°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 14 AWG, 16 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.032" (0.81mm), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean, Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.020" (0.51mm), Bod topenia: 423 ~ 430°F (217 ~ 221°C), Typ tavidla: No-Clean, Drôtené meradlo: 24 AWG, 25 SWG,
Typ: Wire Solder, Zloženie: Sn60Pb40 (60/40), Priemer: 0.032" (0.81mm), Bod topenia: 361 ~ 376°F (183 ~ 191°C), Typ tavidla: No-Clean, Drôtené meradlo: 20 AWG, 21 SWG,
Typ: Solder Paste, Zloženie: Bi57Sn42Ag1 (57/42/1), Bod topenia: 281°F (138°C), Typ tavidla: No-Clean,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.062" (1.57mm), Bod topenia: 423 ~ 430°F (217 ~ 221°C), Typ tavidla: No-Clean, Drôtené meradlo: 14 AWG, 16 SWG,
