Typ proto dosky: SMD to Plated Through Hole Board, Balík prijatý: TSSOP, Smola: 0.020" (0.50mm), Hrúbka dosky: 0.062" (1.57mm) 1/16",
Typ proto dosky: SMD to Plated Through Hole Board, Balík prijatý: TSSOP,
Typ proto dosky: SMD to Plated Through Hole Board, Balík prijatý: SOIC, Hrúbka dosky: 0.062" (1.57mm) 1/16",
Typ proto dosky: SMD to DIP, Balík prijatý: PSOP, SSOP, TSOP, Hrúbka dosky: 0.062" (1.57mm) 1/16",
Typ proto dosky: SMD to Plated Through Hole Board, Balík prijatý: QFP, Hrúbka dosky: 0.062" (1.57mm) 1/16",
Typ proto dosky: SMD to Plated Through Hole Board, Balík prijatý: PLCC, Hrúbka dosky: 0.062" (1.57mm) 1/16",
Typ proto dosky: SMD to Plated Through Hole Board, Balík prijatý: TQFP,
Typ proto dosky: SMD to Plated Through Hole Board, Balík prijatý: SOIC,
Typ proto dosky: SMD to Plated Through Hole Board, Balík prijatý: SOIC, Smola: 0.020" (0.50mm), Hrúbka dosky: 0.062" (1.57mm) 1/16",
