Typ: Solder Paste, Zloženie: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Bod topenia: 411 ~ 424°F (209 ~ 218°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Bod topenia: 410 ~ 424°F (209 ~ 218°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423°F (217°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Bod topenia: 409 ~ 424°F (209 ~ 218°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Bod topenia: 408 ~ 424°F (209 ~ 218°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 350°F (177°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 401 ~ 424°F (205 ~ 218°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Bod topenia: 423°F (217°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Sn63Pb37 (63/37), Bod topenia: 361°F (183°C), Typ tavidla: No-Clean,
Typ: Solder Paste, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Bod topenia: 423°F (217°C),
Typ: Solder Paste, Bod topenia: 546 ~ 567°F (286 ~ 297°C),
Typ: Wire Solder, Zloženie: Sn60Pb40 (60/40), Priemer: 0.064" (1.63mm), Bod topenia: 361 ~ 374°F (183 ~ 190°C), Typ tavidla: No-Clean, Drôtené meradlo: 14 AWG, 16 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.015" (0.38mm), Bod topenia: 361°F (183°C), Drôtené meradlo: 27 AWG, 28 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.125" (3.18mm), Bod topenia: 361°F (183°C), Drôtené meradlo: 8 AWG, 10 SWG,
Typ: Wire Solder, Zloženie: Sn60Pb40 (60/40), Priemer: 0.062" (1.57mm), Bod topenia: 361 ~ 374°F (183 ~ 190°C), Drôtené meradlo: 14 AWG, 16 SWG,
Typ: Wire Solder, Zloženie: Sn60Pb40 (60/40), Priemer: 0.125" (3.18mm), Bod topenia: 361 ~ 374°F (183 ~ 190°C), Drôtené meradlo: 8 AWG, 10 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.062" (1.57mm), Bod topenia: 361°F (183°C), Drôtené meradlo: 14 AWG, 16 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.093" (2.36mm), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Drôtené meradlo: 11 AWG, 13 SWG,
Typ: Wire Solder, Zloženie: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Priemer: 0.125" (3.18mm), Bod topenia: 423 ~ 424°F (217 ~ 218°C), Drôtené meradlo: 8 AWG, 10 SWG,
Typ: Wire Solder, Zloženie: Sn99 (99), Priemer: 0.045" (1.14mm), Drôtené meradlo: 17 AWG, 18 SWG,
Typ: Wire Solder, Zloženie: Sn99 (99), Priemer: 0.078" (1.98mm), Drôtené meradlo: 12 AWG, 14 SWG,
Typ: Wire Solder, Zloženie: Sn63Pb37 (63/37), Priemer: 0.031" (0.79mm), Bod topenia: 361°F (183°C), Drôtené meradlo: 20 AWG, 22 SWG,
Typ: Wire Solder, Zloženie: Sn99 (99), Priemer: 0.062" (1.57mm), Drôtené meradlo: 14 AWG, 16 SWG,
Typ: Wire Solder, Zloženie: Sn99.3Cu0.7 (99.3/0.7), Priemer: 0.047" (1.19mm), Bod topenia: 440°F (227°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 17 AWG, 18 SWG,
Typ: Wire Solder, Zloženie: Sn99.3Cu0.7 (99.3/0.7), Priemer: 0.039" (0.99mm), Bod topenia: 440°F (227°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 18 AWG, 19 SWG,
Typ: Wire Solder, Zloženie: Sn60Pb40 (60/40), Priemer: 0.047" (1.19mm), Bod topenia: 360°F (180°C), Typ tavidla: Rosin Activated (RA), Drôtené meradlo: 17 AWG, 18 SWG,
